Thermal Interface Materials
Explore Our Extensive Range of TIM’s
Material Direct’s extensive product range has defined categories of product types. These have been arranged based on their physical and technical properties for easier understanding.
Electrically Insulating Thermal Materials
The T-Pad thermal interface range offers best price to performance in almost every known application.
Thermal Gap Filling Pad
The benefits of the UniGap product range are broad and varied The products enable a quick-fix thermal solution.
Thermal Gap Filling Putties
UniPutty is a range of thermally conductive, liquid gap filling materials and pastes.
Thermal Adhesive Tape
Thermal adhesive tapes are designed to mechanically fix two surfaces whilst delivering excellent thermal transfer.
Thermal Grease
UniGrease is especially designed for silicone sensitive applications where high thermal performance is crucial.
Thermal Phase Change Materials
UniPhase materials are designed to consistently deliver a defined thickness of thermal interface material and serve as an excellent replacement for thermal grease.
Thermal Grease Replacement Materials
The UniGraph Graphite thermal interface material and phase change product range are designed to be low cost and repeatable alternatives to messy thermal grease.
RFI Shielded Pads
UniShield products offer the engineer a solution for unwanted Radio Frequency Interference (RFI) that can be present in high frequency applications.
Our Materials are used in a wide range of industries and sectors…
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Automotive/EVCustom pads for Electronic assemblies and Battery pack construction / protection made from some of the best materials in the industry -
IndustrialHeavy duty Electronics and Motor Drives need thermal, RFI, and high voltage protection -
PowerHandling power in electronics and Motor drives requires Thermal control, RFI, and Electrical isolation plus many more materials -
MilitaryRugged materials, custom cut to a high standard to suit even the most demanding applications in Electronics today -
LED lightingWe supply light-shaping, reflective anti-Glare diffusing films to maximise the performance of your LED design -
AerospaceLight weight, vibration damping, thermal and RFI parts made to a high quality to protect your electronics
All Thermal Interface Materials
Materials Direct offers one of the highest quality and most diverse ranges of thermal management materials in the world
- All
- Electrically Insulating TIM
- Non-silicon Gap Pad
- Phase Change
- Thermal Gap Pad
- Compliant and electrically insulating
- Thermal conductivity = 1.8 W/mK
- Delivers excellent vibration dampening properties
- Ceramic filled gap filling pad
- Thermal conductivity = 6.0W/mK
- Compliant surfaces on both sides function to reduce interfacial thermal resistance
- 2.7 W/m K thermal conductivity
- Low pressure versus deflection characteristics
- Excellent surface wetting for low contact resistance
- Silicone free
- Differential tack option available for easy assembly and rework
- Minimal compression set
• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.1 W/mK thermal conductivity
- Superior replacement for messy thermal greases.
- Operating temperature range: up to 150ºC.
- Highly efficient thermal transfer material.
- Superior replacement for messy thermal greases.
- Operating temperature range: up to 150ºC.
- Highly efficient thermal transfer material.
- Filled silicone rubber material that does not require curing
- Formulated to provide clean release from most surfaces
- Material is rigid enough to be easily die cut
- Compliant and electrically insulating
- Thermal conductivity = 1.8 W/mK
- Delivers excellent vibration dampening properties
- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
- Thermal impedance: 0.23°C-in2/W (@50 psi)
- Naturally tacky on both sides
- Pad is repositionable
- Good thermal stability of the base polymer with excellent softness of the thermal pad.
- Good thermal conductivity in a soft silicone polymer base.
- The product tack is such that a mechanical means to support the pad in a final assembly is required.
- High dielectric strength and thermal performance
- Thermal conductivity of 6.5W/mK
- Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
- Good thermal conductivity (3.1 w/m-k)
- Good softness and is conformable at low pressure ( Shore 00 = 50)
- Softness results in low stress on board components
- Good softness and conformability to non-flat surfaces
- Excellent compressive stress relaxation
- Non-silicone acrylic elastomer
- Good thermal stability of the base polymer with excellent softness of the thermal pad.
- Good thermal conductivity in a soft silicone polymer base.
- The product tack is such that a mechanical means to support the pad in a final assembly is required.
- Low thermal resistance at low pressures
- Reusable: make and break thermal interface connection many times
- Naturally tacky at room temperature, no adhesive required
- High dielectric breakdown of 6,000 volts
- Film base resistant to cut through
- Thermal resistance of 0.55ºC-in2/watt @ 50 psi pressure
- High breakdown voltage of > 6,000 volts AC
- Thermal resistance of 0.48º C-in2/watt at 50 psi
- Thermal resistance of 0.28º C-in2/watt at 400 psi
- High breakdown voltage of 4,000 – 9,000 range VAC
- Resistant to tears and cut through
- Total thermal resistance of 0.13 – 0.30 range ºC-in2/watt at 20 psi clip force
- High breakdown voltage of 4,000 – 9,000 range VAC
- Resistant to tears and cut through
- Total thermal resistance of 0.13 – 0.30 range ºC-in2/watt at 20 psi clip force
- High breakdown voltage of 6,000 volts AC
- Thermal resistance of 0.50º C-in2/watt at 50 psi
- Unique coating formulation offers low mounting forces
- Low thermal resistance at low pressures
- Reusable: make and break thermal interface connection many times
- Naturally tacky at room temperature, no adhesive required
- Low total thermal resistance (0.013°C-in2/W at 50 psi)
- inherently tacky and easy-to-use – no adhesive required
- High reliability
- Low total thermal resistance (0.013°C-in2/W at 50 psi)
- inherently tacky and easy-to-use – no adhesive required
- High reliability
- 0.03ºC-in2/watt thermal resistance
- Naturally tacky at room temperature, no adhesive required
- No heatsink preheating required
- Thermal conductivity 5.0 W/mK
- Highly compliant
- Low thermal resistance even at low pressure
- Silicone free
- Differential tack option available for easy assembly and rework
- Minimal compression set
- Silicone free
- Differential tack option available for easy assembly and rework
- Minimal compression set
- Silicone free
- Differential tack option available for easy assembly and rework
- Minimal compression set
- Thermal conductivity 5.0 W/mK
- Highly compliant
- Low thermal resistance even at low pressure
- Thermal conductivity 5.0 W/mK
- Highly compliant
- Low thermal resistance even at low pressure
- Thermal conductivity 5.0 W/mK
- Highly compliant
- Low thermal resistance even at low pressure
- Thermal conductivity 5.0 W/mK
- Highly compliant
- Low thermal resistance even at low pressure
- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
- Thermal Conductivity 1.8 W/mK
- Soft and Compliant
- Available in thicknesses from 0.020” thru 0.400” (0.5mm thru 10.2mm)
- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
- Thermal Conductivity 1.8 W/mK
- Soft and Compliant
- Available in thicknesses from 0.020” thru 0.400” (0.5mm thru 10.2mm)
- Thermal Conductivity 1.8 W/mK
- Soft and Compliant
- Available in thicknesses from 0.020” thru 0.400” (0.5mm thru 10.2mm)
- Extreme compliancy allows material to “totally blanket” components
- Thermal conductivity of 1.2 W/mK
- Low compression set enables the pad to be reused many times
- Extreme compliancy allows material to “totally blanket” components
- Thermal conductivity of 1.2 W/mK
- Low compression set enables the pad to be reused many times
- Extreme compliancy allows material to “totally blanket” components
- Thermal conductivity of 1.2 W/mK
- Low compression set enables the pad to be reused many times
- Soft and compressible for low stress applications
- Naturally tacky needing no further adhesive coating
- 1.1 W/mK thermal conductivity
- Soft and compressible for low stress applications
- Naturally tacky needing no further adhesive coating
- 1.1 W/mK thermal conductivity
- Soft and compressible for low stress applications
- Naturally tacky needing no further adhesive coating
- 1.1 W/mK thermal conductivity
- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
- Ceramic filled gap filling pad
- Thermal conductivity = 6.0W/mK
- Compliant surfaces on both sides function to reduce interfacial thermal resistance
- Ceramic filled gap filling pad
- Thermal conductivity = 6.0W/mK
- Compliant surfaces on both sides function to reduce interfacial thermal resistance
- Ceramic filled gap filling pad
- Thermal conductivity = 6.0W/mK
- Compliant surfaces on both sides function to reduce interfacial thermal resistance
- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
- Thermal Conductivity: 1.0 W/m-K
- Conformable, low hardness
- “Gel-like” modulus
- Thermal impedance: 0.33ºC-in2/W @ 50 psi
- Optimal heat transfer
- High Thermal Conductivity: 3.5 W/m-K
- Thermal impedance: 1.13ºC-in2/W @ 50 psi
- Original Sil-Pad material
- Excellent mechanical and physical characteristics
- Thermal impedance: 0.61ºC-in2/W (@50 psi)
- Electrically isolating
- Low mounting pressures
- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
- Soft and compliant gap filler with excellent thermal performance
- Thermal conductivity = 3.0 W/ mK
- Integral support using fabric or polymer film
- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
- Extremely compliant and electrically insulating
- Thermal conductivity = 1.7W/mK
- Naturally tacky, no need for adhesive
- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
- High dielectric strength and thermal performance
- Thermal conductivity of 6.5W/mK
- Soft and compliant to minimise interfacial thermal resistance but rugged and strong in its application
- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
- Electrically insulating and moderate thermal performance properties
- Thermal conductivity = 1.5 W/mK
- Requires mounting pressure via spring, metal clip or clamp
- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications such as LED COB
- Non-reinforced film
- Dry compound coated onto an aluminium substrate
- Above phase change temperature compound becomes thixotropic and paste-like in consistency
- Delivers a highly reliable and consistent thermal interface for demanding applications
- Silicon Free with Low thermal resistance
- Highly reliable and consistent thermal interface for demanding applications such as LED COB
- Non-reinforced film
- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
- Compliant and electrically isolating
- Thermal conductivity = 1.0 W/mK
- Maintains good thermal performance over a temperature range of -50°C to 160°C
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There is NEVER a tooling charge for manufacturing
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Parts made & shipped worldwide in as little as 24 hours
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Technical expertise available from our specialists
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